Huawei has announced two silicon carbide cooling technologies
On September 22nd, it was announced that Huawei recently disclosed two patents: "Thermal Conductive Composition and Its Preparation Method and Application" and "A Thermal Conductive and Absorptive Composition and Its Application". Both of these patents use silicon carbide as the filler to enhance the thermal conductivity of electronic devices.
Among them, the application fields of the former include the heat dissipation of electronic components and the packaging of chips (substrates, heat sinks), while the application fields of the latter include electronic components and circuit boards.
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