Hong Kong's chip industry layout aims at new tracks!
Under the backdrop of favorable policies and market demand, the development of the integrated circuit industry in the Guangdong-Hong Kong-Macao Greater Bay Area has been continuously improving. Among them, the chip industry in Hong Kong is demonstrating vigorous vitality and considerable development potential. The third-generation semiconductor is an obvious layout focus for Hong Kong's chip industry. At the beginning of this year, the first silicon carbide wafer fabrication plant project was established in Hong Kong, and there are also two production lines related to the third-generation semiconductor in this area. In addition, new tracks are also gathering momentum. Market dynamics indicate that this time Hong Kong will bet on the RISC-V field.
Aiming at RISC-V, a Hong Kong investment company has made a strategic investment in Sipeed Technology
Recently, the strategic cooperation launch ceremony between Hong Kong Investment Management Company Limited (HKSTP) and Unisoc Technology and the first Hong Kong RISC-V Development Summit Forum were held at the Hong Kong Convention and Exhibition Centre.
Hong Kong Investment Company announced its investment in Unisoc Technology and will provide comprehensive support for Unisoc Technology's subsequent development in Hong Kong. Sipeed Technology will establish a subsidiary and conduct business in Hong Kong to promote the development of RISC-V chips, application implementation and talent cultivation in Hong Kong.
Sipeed Technology disclosed that it will continue to deepen its R&D layout in Hong Kong, collaborate with more industry leaders and local enterprises, launch more RISC-V chips featuring high technology, high performance and high quality, and create a batch of RISC-V innovative applications to facilitate Hong Kong's digital and intelligent transformation, promoting the development of new quality productivity in Hong Kong.
Currently, Sipefive Technology is collaborating with Superconvergence to steadily advance the application of its self-developed data center-level RISC-V chip, "Lion Mountain Core", in SuperConvergence's intelligent computing products. Meanwhile, Sipeed Technology has joined hands with China Mobile Hong Kong, Hong Kong China Gas and China Mobile Xinsheng Technology to jointly promote the application of the industry's first RISC-V Internet of Things security chip "Hong Kong Huaxin" in Hong Kong, serving millions of families in Hong Kong. This chip will significantly enhance the intelligent management level of gas and contribute to the construction of a smart city in Hong Kong. At present, the shipment volume of "Honghua Chip" in the Chinese mainland has exceeded 4 million pieces.
According to the data, RISC-V is an open-source, free and highly scalable Reduced Instruction Set computing (RISC) architecture that is disrupting the traditional chip design field. As the world's third-largest architecture, RISC-V can provide Chinese enterprises with a new path to bypass the x86/ARM patent barriers.
At the event ceremony, Mr. Paul Chan, the Financial Secretary of the Hong Kong Special Administrative Region Government, said:
The rapid development of RISC-V, which takes the open-source architecture as the approach, will accelerate the transformation of the chip industry. With its open-source and minimalist nature, the research and product design teams have a greater space to innovate and experiment in the design of chips, intelligent computing and electronic products. By combining the characteristics of the RISC-V architecture with the advantages of Hong Kong, we can bring new heights to industrial co-creation, international cooperation and talent cultivation. With the full support of the SAR government, the full commitment of Hong Kong Investment companies, and the full participation of technology enterprises, we will be able to accelerate the development of an independent and controllable technology ecosystem in the technological development of RISC-V, and contribute Hong Kong's strength to the country's high-level self-reliance and self-strengthening in science and technology.
After the first silicon carbide wafer fabrication plant project was implemented, Hong Kong also has two third-generation and a half production lines
In the field of third-generation semiconductors, Hong Kong's "Innovation and Technology Development Blueprint" explicitly states that it will support advanced semiconductor manufacturing, promote "new industrialization", and focus on supporting technological breakthroughs and industrial applications of third-generation semiconductors.
In January this year, Jefang Semiconductor and the Hong Kong General Chamber of Commerce (FHKI) officially signed a Memorandum of Understanding (MOU) to establish an 8-inch wafer fab for third-generation semiconductor silicon carbide in Hong Kong. The project is expected to have a total investment of approximately 6.9 billion Hong Kong dollars and is scheduled to be officially put into production in 2026.
This project is the first third-generation semiconductor silicon carbide wafer factory in Hong Kong, positioned as a vertical integrated manufacturing (IDM) model, combining R&D and production, with the goal of promoting the autonomy of the chip supply chain in the Greater Bay Area. After the project reaches its full production capacity, it can produce 240,000 wafers annually, which will be able to meet the production demands of 1.5 million new energy vehicles. It is expected that the annual output value will exceed 11 billion Hong Kong dollars.
After the 8-inch silicon carbide wafer production line of Jiefang, in March, media reports indicated that the Hong Kong Microelectronics Research Institute (MRDI) is setting up two 8-inch third-generation semiconductor pilot lines, respectively responsible for the research and development and production of silicon carbide and gallium nitride. It is planned to complete the installation and commissioning within this year.
It is learned that in May last year, the Legislative Council of Hong Kong approved the establishment of the Hong Kong Microelectronics Research Institute with a budget of 2.84 billion Hong Kong dollars, focusing on the research and development of third-generation semiconductor technologies, including pilot lines for silicon carbide and gallium nitride, and supporting cooperation among industry, academia and research. The Hong Kong Microelectronics Research Institute plans to allocate 2.478 billion Hong Kong dollars for the establishment of a pilot production line, and the remaining funds will be used for operating expenses within five years.
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